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Article: Automated Inspection and Classification of Flip-Chip Contacts Using Scanning Acoustic Microscopy
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Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies
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Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications
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Non-destructive Failure Analysis of Packaged IGBT Modules by Scanning Acoustic Microscopy
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Analysis of Mono Crystalline Si by Scanning Acoustic Microscopy (Auto Ingot)
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New Developments and Progress in Acoustic Imaging and Analysis for Semiconductor Applications

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