The SAM 300 Auto Wafer is product line specially developed for inline production control. It conforms to cleanroom class 10 and was designed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.

This line was specially developed for the production control of electronic devices, boards, IGBTs, and other complex components. The systems conform to cleanroom class 10. The primary application involves verifying defects such as gaps, bubbles, holes, inclusions, delaminated areas, or thickness variations in soldered or Ag-sintered interfaces. Multiple layers can be inspected simultaneously.