SAM Auto Line

The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.

Product Information

Find in-depth information about the possibilities of ultrasound inspection, our systems, transducers, and software as well as specific application possibilities.

Auto Wafer

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    The SAM 300 Auto Wafer is product line specially developed for inline production control. It conforms to cleanroom class 10 and was designed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.

Auto Tray

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    This line was specially developed for the production control of electronic devices, boards, IGBTs, and other complex components. The systems conform to cleanroom class 10. The primary application involves verifying defects such as gaps, bubbles, holes, inclusions, delaminated areas, or thickness variations in soldered or Ag-sintered interfaces. Multiple layers can be inspected simultaneously.

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PVA TePla Analytical Systems GmbH
Deutschordenstrasse 38
73463 Westhausen, Germany

Phone: +49 7363 9544 0
Fax: +49 7363 9544 113

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