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Search results 1 until 10 of 360
  • 1. SAM Line - SAM 300  
    SAM 300  
  • 2. SAM Line  
    SAM 304 Low-maintenance, high-speed linear motor scanner Analysis of samples in the ultrasound frequency range up to 400 MHz Equipped with a graphical user interface for ease of…  
  • 3. 3D Puck metrology - Product data  
    Product data Puck dimensions: The standard system comes with holders for 6 and 8 inches, allowing thicknesses from 5 to 45 mm. Puck geometry: Cylindrical with one, two, or…  
  • 4. 3D Puck metrology  
    3D puck metrologySiC Defect Mapping Process The SiC puck scanning applies advanced 3D metrology to map internal defects in SiC before  wafering. 3D Scanning: The SiC puck is scanned to…  
  • 5. 3D Puck metrology  
    SAM 301 SiC In traditional SiC substrate production, the first comprehensive control of internal defects takes place at wafer level, when substantial resources have already been spent for…  
  • 6. SAM Premium Line  
    SAM 301 SiC To product pageSAM 1000/2000These two systems were developed for high-end research and industry applications. A combined scanning acoustic microscope and an inverted light…  
  • 7. 3D Puck metrology  
    The SAM 301 SiC, developed by Scientific Visual and PVA TePla, enables advanced 3D mapping of internal defects in silicon carbide (SiC) pucks. The concept is straightforward: it becomes possible to…  
  • 8. SAM Premium Line  
     
  • 9. 3D Puck metrology  
    Yes, there is no difference in scanning quality.  
  • 10. 3D Puck metrology  
    The scanner visualizes most lattice defects, including micropipes, polytypes, dislocation bundles, and inclusions. Individual dislocations are not visible.  

Search results 1 until 10 of 360

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PVA TePla Analytical Systems GmbH
Deutschordenstrasse 38
73463 Westhausen, Germany

Phone: +49 7363 9544 0
Fax: +49 7363 9544 113

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