SAM 304 Low-maintenance, high-speed linear motor scanner Analysis of samples in the ultrasound frequency range up to 400 MHz Equipped with a graphical user interface for ease of…
Product data Puck dimensions: The standard system comes with holders for 6 and 8 inches, allowing thicknesses from 5 to 45 mm. Puck geometry: Cylindrical with one, two, or…
3D puck metrologySiC Defect Mapping Process The SiC puck scanning applies advanced 3D metrology to map internal defects in SiC before wafering. 3D Scanning: The SiC puck is scanned to…
SAM 301 SiC In traditional SiC substrate production, the first comprehensive control of internal defects takes place at wafer level, when substantial resources have already been spent for…
SAM 301 SiC To product pageSAM 1000/2000These two systems were developed for high-end research and industry applications. A combined scanning acoustic microscope and an inverted light…
The SAM 301 SiC, developed by Scientific Visual and PVA TePla, enables advanced 3D mapping of internal defects in silicon carbide (SiC) pucks. The concept is straightforward: it becomes possible to…
The scanner visualizes most lattice defects, including micropipes, polytypes, dislocation bundles, and inclusions. Individual dislocations are not visible.
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