Artikel: Automated inspection and classification of flip-chip contacts using Scanning Acoustic Microscopy

Failure analysis using scanning acoustic microscopy for diagnostics of electronic devices and 3D system integration technologies

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

Non-Destructive Failure Analysis of Packaged IGBT Modules by Scanning Acoustic Microscopy

Analysis of mono crystalline Si by scanning acoustic microscopy (auto ingot)

New developments and progress in acoustic imaging and analysis for semiconductor applications